Westwind to Showcase Latest Air Bearing Innovations at Semicon West
POOLE , UK, 11 July 2006 – Westwind Air Bearings, the World Leader in air bearing spindle systems, will be showcasing a range of spindle technologies for semiconductor processing including spindles for ion implantation, wafer dicing and wafer grinding.
Westwind supplies state-of-the-art wheelhead and workhead air bearing spindles, with speeds up to 15,000 rpm, for wafer grinding applications up to 300mm diameter. Westwind wafer dicing spindles, used for dicing silicon, ferrite and other hard materials, are capable of carrying single or multiple blades with diameters from 50 to 100mm. Recent developments for 300mm wafer processing include longer bodies for greater reach, larger brushless DC motors for greater power up to 2.2kW and rotational speeds up to 60,000 rpm. In addition, Westwind will also be exhibiting an air bearing linear slide for high vacuum process applications.
Westwind provide bespoke motion control solutions to challenging technical and process requirements. One of the latest developments for improved productivity is a dual shaft tool design, which performs both rough grind and finish grind operations with a single spindle. Benefits of using air bearings include high precision, cleanliness of operation, operation in high vacuum environments, high bearing stiffness and high rotational speeds up to 300k rpm.
If you have a challenging application requiring a high-precision, high-integrity solution, visit Westwind, booth #6084, North Hall, Moscone Centre.
GSI Group Inc. develops and delivers the enabling technology solutions that bring advanced manufacturing applications to life. Our leading brands include precision motion products, lasers, and laser systems, and are used to increase efficiency and productivity in the global medical, semiconductor, electronics, and industrial markets. The company's common shares are listed on Nasdaq (GSIG) For more info rmation please visit www.gsig.com and www.westwind-airbearings.com.