Westwind to Showcase Semiconductor Processing Spindle Range
POOLE, ENGLAND, July 2005 - Westwind Air Bearings, the World’s leading air bearing spindle supplier to the semiconductor industry, will be showcasing a range of air bearing spindles for semiconductor processing including spindles for wafer spinning, back grinding, edge grinding and dicing. One of Westwind’s latest developments for improved productivity is a dual shaft design, which performs both rough grind and finish grind operations with a single spindle.
Westwind supplies state-of-the-art wheelhead and workhead air bearing spindles, with speeds up to 15,000 rpm, to many major equipment OEMs for wafer grinding applications up to 300mm diameter. The high quality motion, incredible precision, minimal vibration and high bearing stiffness make air bearing spindles ideal for wafer back grinding.
Used for dicing silicon, ferrite and other hard materials, Westwind wafer dicing spindles are capable of carrying single or multiple blades with diameters from 50 to 100mm. Recent developments for 300mm wafer processing include longer bodies for greater reach, larger brushless DC motors for greater power up to 2.2kW and rotational speeds up to 60,000 rpm. In addition, Westwind will be exhibiting an air bearing linear slide for high vacuum process applications.
GSI Group Inc. develops and delivers the enabling technology solutions that bring advanced manufacturing applications to life. Our leading brands include precision motion products, lasers, and laser systems, and are used to increase efficiency and productivity in the global medical, semiconductor, electronics, and industrial markets. The company’s common shares are listed on Nasdaq (GSIG). For more information on GSI Group, please visit www.gsig.com.
For more information, please contact:
Westwind Air Bearings
Holton Road, Holton Heath
Poole, Dorset. BH16 6LN. UK
Tel: +44 01202 627259
Fax: +44 01202 627208